SIMCOM has launched its new generation intelligent module, the SIM8965 series, targeting the Chinese and global markets. This addition enhances its lineup of smart module products. As a globally recognized provider of IoT modules and solutions, SIMCOM’s rich array of smart modules provides robust support for clients in developing edge computing and on-device AI products.
SIMCOM SIM8965 is an LTE Cat.4 intelligent module built on the Qualcomm SM6115 chipset platform, featuring an 8-core 64-bit ARM Kryo260 processor and Adreno™ 610 GPU with a frequency of up to 2.0GHz. In terms of connectivity, the SIM8965 supports LTE Cat.4, with downlink speeds of up to 150Mbps and uplink speeds of up to 50Mbps, and is compatible with global frequency bands, facilitating data communication across various network types including GSM/GPRS/EDGE, WCDMA/HSPA+, LTE-FDD, and LTE-TDD.
Additionally, this SIMCOM LTE module supports Wi-Fi 5 and Bluetooth 5.1 functionalities, and integrates a multi-constellation GNSS receiver supporting multiple satellite positioning systems such as GPS, BeiDou, GLONASS, Galileo, and QZSS, providing robust network connectivity and high-precision positioning capabilities.
The SIMCOM SIM8965 module excels in image processing, supporting dual cameras of 13MP+13MP or 25MP+5MP, and the main screen supports FHD+ (2520*1080) at 60fps, with encoding capabilities for 1080P at 60fps, ensuring smooth playback and high-quality recording of HD video content. In terms of audio, the SIM8965 supports various audio encoding formats and voice codec technologies, delivering a high-quality voice communication experience.
Moreover, the SIM8965 integrates Android OS, Wi-Fi, Bluetooth, and GNSS functionalities into a single module, simplifying system design, reducing development costs, and enhancing system stability and reliability. The SIM8965 is also compatible with SIMCOM’s SIM8918 series, offering high integration and compatibility for customers’ product innovation and upgrade needs.
With a variety of interfaces, the SIM8965 enhances user experience by offering multiple application possibilities. The module is packaged in LCC+LGA with dimensions of 40.5 x 40.5 x 3.0 mm, incorporating rich interfaces such as MIPI_DSI, CSI, UART, SPI, I2C, GPIO, and USB, allowing for connection with cameras, displays, audio, and sensors for multi-dimensional data collection and human-machine interaction. Its strong application potential in facial recognition, voice recognition, and intelligent detection makes it a reliable ally for digital transformation in fields like smart payment, advertising media, smart vehicles, remote diagnostics, and smart industry.
As the Internet of Things and artificial intelligence technologies rapidly evolve, intelligent modules will play an increasingly vital role as the bridge between the physical and digital worlds. SIMCOM’s new SIM8965 intelligent module, with its high performance, high integration, and rich interface design, contributes significantly to the digital transformation of industries. Additionally, the SIM8965 series features a long lifecycle, meeting customer demands for reliability and stability, with both domestic and global frequency versions available to accommodate differentiated customer needs.
In response to the diverse demands for intelligent modules in the Chinese and global markets, SIMCOM is developing different versions of products with varying computing power, packaging forms, and frequency bands tailored for different countries and regions. In the future, based on a comprehensive range of full-standard and multi-matrix product lines, SIMCOM will continue to innovate and develop high-quality products to promote a brighter future for IoT and artificial intelligence technologies.
During the AIoT Korea Exhibition 2024 in Seoul, FIBOCOM announced the launch of its 5G module FG370-KR, providing outstanding 5G solutions for Korea’s 5G AIoT industry and accelerating the large-scale commercial use of 5G in the country.
According to a 2023 report from the Korea Communications Commission, the number of 5G users in South Korea has reached 32.81 million. Furthermore, global consulting firm Omdia predicts that by the end of 2024, the number of 5G users in South Korea will exceed that of 4G, reaching 69 million by 2028. Currently, the South Korean 5G market is leading globally and shows a strong growth trend. The accelerated commercialization of 5G in Korea is not only generating a wealth of industry applications in sectors such as industrial connectivity, healthcare, smart cities, and entertainment, but is also speeding up the deployment of fixed wireless access (FWA) broadband services. The FIBOCOM 5G module FG370-KR is compatible with mainstream 5G frequency bands in Korea, facilitating the rapid deployment of 5G FWA in the market.
The Fibocom FG370-KR is based on the high-performance MediaTek T830 platform, supporting the 3GPP R16 evolution standard. It utilizes a 4nm process technology and features a quad-core Arm Cortex-A55 CPU, delivering a 10% performance improvement over the previous MediaTek T750 platform. Additionally, the T830 integrates hardware-level MediaTek Network Acceleration Engine and Wi-Fi Offload Engine, providing gigabit-level throughput for 5G cellular network transmission to Ethernet or Wi-Fi without increasing CPU load, thus delivering an exceptional network experience. In terms of 5G speed, the FG370-KR includes the M80 5G modem, supporting Sub-6GHz full-band 5G networks, allowing end customers to enjoy a broadband 5G experience. The FG370-KR supports up to 300MHz bandwidth in FDD and TDD mixed modes, with downlink NR 4CA (four-carrier aggregation) and uplink NR 2CA (two-carrier aggregation), offering downlink speeds of up to 7Gbps. For signal coverage, the FG370-KR supports PC2 technology for High Power User Equipment (HPUE), enhancing 5G uplink capabilities and expanding effective coverage.
The Fibocom FG370-KR supports a variety of peripheral interfaces, including three PCI-Express ports, USB 3.2, and two USXGMII interfaces with speeds of up to 10GbE, and can be expanded with PCM/SPI interfaces to support RJ11 phone interfaces. Meanwhile, the FG370-KR also supports diverse storage configurations, efficiently meeting various storage requirements for different applications.
With MediaTek’s 5G UltraSave power-saving technology, the FG370-KR optimizes its operating mode according to the 5G network environment, reducing communication power consumption and significantly enhancing user experience for broadband access products.
Thanks to these hardware and software features, the FG370-KR will continue to deliver enhanced performance, higher speeds, and greater specialization in comprehensive solutions for end customers. FIBOCOM, as a global leader in MBB FWA solutions, will continue to provide innovative products and solutions for the global 5G market, driving the accelerated development of 5G broadband.
Tao Xi, Vice President of the MBB Product Management Department at FIBOCOM, stated:
“In response to the rapidly developing Korean 5G market, FIBOCOM has launched the high-performance 5G module FG370-KR, helping local operators and end customers achieve commercial success in FWA quickly. Based on the MediaTek T830 platform, the FG370-KR combines powerful 5G features, and its exceptional quality will continue to empower smart homes, enterprise office environments, and other intelligent scenarios. In the future, FIBOCOM will keep providing high-value 5G solutions across various application fields.”
Recently, Quectel’s 5G RedCap module RG255C-GL has successfully passed multiple international certifications for the global market, including GCF global certification, North American FCC, IC, PTCRB certifications, European CE certification, and Australian RCM certification.
This means the Quectel RG255C-GL RedCap module is now fully commercially available and meets the stringent requirements for RedCap network connectivity in markets such as Europe, North America, and Australia. With balanced technical performance, this product provides stable and reliable connectivity support for IoT terminals like CPEs, MiFis, routers, gateways, locators, and industrial PDAs.
RedCap, a lightweight IoT technology derived from 5G NR, achieves cost optimization, size reduction, and lower power consumption by streamlining device capabilities and complexity. Meanwhile, RedCap retains important 5G native features, such as low latency, high reliability, and support for functions like 5G slicing and 5G LAN, making it highly suitable for the digital transformation needs of vertical industries.
Powerful Core, Achieving All-Around Excellence
The Quectel RG255C-GL module is based on the Qualcomm Snapdragon® X35 platform, designed for the global market, and widely compatible with major operators. It complies with the 3GPP R17 standard, supports 5G Sub-6 standalone (SA) mode and LTE Cat 4 networks, and is compatible with Rel-15 (SA) and Rel-16 (SA) networks, meeting the seamless integration and flexible deployment needs of terminal devices. The module also supports low-latency communication and key 5G features such as 5G LAN, uRLLC, and network slicing.
The RG255C-GL achieves a downlink speed of up to 223 Mbps and a peak uplink speed of 123 Mbps, suitable for entry-level FWA applications, video transmission, and mid-to-high-speed IoT requirements.
Additionally, the Quectel RG255C-GL supports the OpenWrt operating system, providing router customers with a wide range of flexible development options. This module also integrates Qualcomm® IZat™ positioning technology, supporting GPS, GLONASS, BDS, Galileo, and NavIC positioning technologies for faster, more precise, and reliable enhanced positioning services.
Compact Design, Demonstrating Exceptional Strength
Not only is the 5G Module powerful in performance, but it also features a sleek and compact design. It uses a compact LGA package, measuring only 32.0 mm × 29.0 mm × 2.4 mm, consistent in size with Quectel’s classic LTE Cat 4 module EG2x series, significantly simplifying the upgrade process for 4G devices, effectively shortening development cycles and reducing costs.
Moreover, the RG255C-GL integrates a rich set of interfaces, including USB 2.0, PCIe 2.0, PCM, UART, SGMII, and SPI, supporting various drivers and software functionalities, expanding its wide-ranging applications in the RedCap field.
In addition, this Quectel 5G module can be paired with various antennas from Quectel, allowing terminal customers to choose compatible antennas based on actual needs, thus reducing costs and accelerating product time-to-market.
Recently, Quectel, a leading global IoT solution provider, announced that its new 5G-A series module RG650V has become the first product based on Qualcomm’s Snapdragon X72 platform to successfully pass GCF/PTCRB certification.
The passing of these two certifications indicates that the Quectel RG650V meets the relevant regulations and standards for regions such as North America, achieving a secure and stable compatibility status with major operators in those regions, providing users with efficient and reliable 5G communication services. Notably, the RG650V has also passed the US FCC certification.
Consistency certification is a key step in bringing IoT devices to market. PTCRB certification focuses on device compatibility and performance on North American operator networks, while GCF is an international product consistency certification. Together, they provide dual assurance for compliant sales of wireless communication devices in key global markets. The RG650V, as the first module based on the Snapdragon X72 platform to pass both certifications, further demonstrates the leading edge of Quectel 5G modules and the company’s overall strength.
Developed on the world’s first 5G Advanced-ready modem and RF system—the Qualcomm Snapdragon X72—the RG650V employs 3GPP Rel-17 technology, supporting 5G NSA and SA modes, as well as Option 3x, 3a, 3, and Option 2 network architectures. It also supports extended 8Rx frequency bands and DL 4 × 4 MIMO technology to enhance 5G network coverage, transmission efficiency, and user experience. Additionally, the series is backward compatible with 4G/3G and supports the latest Wi-Fi 7 technology, introducing up to 4K QAM modulation and 2.4/5/6 GHz Wi-Fi, ensuring stable operation even in areas lacking 5G deployment.
For high-precision positioning applications, the RG650V series incorporates Qualcomm’s advanced IZat™ positioning technology (Gen 9VT) and an optional multi-constellation GNSS receiver, supporting GPS, GLONASS, BDS, Galileo, and QZSS positioning technologies. This enables faster, more accurate, and reliable positioning while simplifying product design and allowing for real-time adjustments based on terminal needs.
To expand the RG650V series’ application possibilities, the module features a range of industrial-standard interfaces, including USB 2.0/3.0/3.1, PCIe 3.0, PCM, and UART. It also comes with the OpenWrt operating system, offering broad and flexible development options for router customers. The series includes RG650V-EU and RG650V-NA versions to meet different regional requirements.
In recent years, the deep integration of 5G with AR/VR, ultra-high-definition video, big data, cloud computing, and the metaverse has driven innovation in 5G applications, creating new business models and experiences. At the same time, new industries present new network connection demands, making 5G-A a timely solution. The new 5G-A module RG650V series from Quectel not only stands out in terms of timeliness and leadership but also excels in performance, supporting the comprehensive upgrade of the communications industry chain and driving rapid digitalization across various sectors.
Recently, Quectel announced that its high-end 5G Smart module SG560D-NA, based on the Qualcomm QCM6490 platform, has successfully received PTCRB certification. Prior to this, the module also obtained certifications from the US FCC and Canada’s IC, indicating that it fully meets the standards and regulations for North America. This ensures efficient and stable operation of related smart devices in the region, aiding customers in rapidly expanding into the North American market.
High-End 5G Performance Leader
The Quectel SG560D-NA, developed on the Qualcomm QCM6490 platform, features a high-performance octa-core 64-bit processor and an integrated Qualcomm Adreno™ 643 GPU (high-performance graphics engine), with a combined computing power of up to 14 TOPS. It offers efficient edge computing capabilities and rich multimedia features. Thanks to the dedicated NPU of the Qualcomm QCM6490 platform, the module achieves an optimal balance between performance and power consumption.
As an intelligent module product integrating 5G and edge computing capabilities, the SG560D-NA also boasts excellent wireless performance. It complies with the 3GPP R15 standard, supports both 5G NSA and SA modes, and is backward compatible with 4G/3G networks, providing comprehensive coverage of various network types. It supports 5G & LTE multiple-input multiple-output (MIMO) technology, delivering high-speed, stable, and ubiquitous cellular connectivity to end devices.
Moreover, the SG560D-NA supports Wi-Fi 6E & DBS, IEEE 802.11a/b/g/n/ac/ax, Wi-Fi 2 × 2 MU-MIMO, and Bluetooth 5.2 technology, further diversifying wireless connection options and significantly enhancing data transfer efficiency and reliability.
Additionally, the module integrates a multi-constellation GNSS receiver, supporting GPS, GLONASS, BDS, NavIC, Galileo, QZSS, and SBAS positioning systems, and supports dual-frequency positioning, effectively meeting the positioning needs of end devices.
Smart and Flexible, Widely Applicable
The SG560D series runs on Android 13 and can be upgraded to Android 14/15 in the future. It also supports Windows, Linux, Ubuntu, and other operating systems, providing a broad range of options for various edge intelligent applications through its “one module, four systems” approach. This flexibility caters to the diverse needs of different industries and application scenarios.
The Quectel 5G Smart module features robust multimedia capabilities, with its built-in Adreno™ 643 GPU and 12 TOPS NPU power, facilitating quick and high-quality graphics rendering. Coupled with 4K H.265/H.264 video encoding and decoding capabilities, it delivers a smoother experience for multimedia-intensive scenarios.
Additionally, the SG560D-NA offers a range of functional interfaces such as LCM, camera, touchscreen, PCIe, UART, USB, I2C, and I2S, greatly expanding its application scope in the smart IoT field. It can be used in various domains including smart cash registers, intelligent robots, edge computing terminals, vending machines, facial payment terminals, smart gateways, CPE, MiFi, MID, PND, POS, routers, digital billboards, industrial PDAs, and smart security.
Furthermore, to accelerate the deployment of intelligent applications, Quectel provides a series of matching antenna products to help customers simplify terminal design and shorten product time-to-market.
In addition to the completed PTCRB, FCC, and IC certifications, the SG560D-NA is also undergoing certification with AT&T, Verizon, and T-Mobile. Moving forward, the module will continue to leverage its advantages in connectivity, edge computing, multimedia performance, and multi-system support to contribute further to intelligent development across more regions and industries.
Here now the Quectel QSM560DR 5G Smart Board based on Quectel SG560D module for industrial application is available here： https://www.4gltemall.com/quectel-qsm560dr-5g-smart-control-board.html .