AI
At this year’s MWC, Artificial Intelligence (AI) was undoubtedly the brightest star. With the explosion of generative AI technology, more and more companies are starting to apply it across various fields. From intelligent customer service to autonomous driving, from content creation to office collaboration, AI is gradually permeating every aspect of our lives. Especially in the fields of consumer electronics and payments, the integration of AI technology has made devices such as smartphones, PCs, smart glasses, smart payment systems, and smart toys more intelligent and personalized.
SIMCOM participated in this year’s MWC by showcasing a series of products, such as the high-performance smart module SIM9650L and the 4G smart module SIM8965. These modules integrate cutting-edge AI algorithms and hardware design, providing powerful computing and data processing capabilities, thus driving the intelligent upgrade of smart terminal devices.
SIMCOM also made its debut by launching the SIMCom AI Stack, a full-stack AI solution based on its AIoT module matrix, aimed at helping customers address the pain points in the practical application of AI on the edge. This solution helps to build a complete and efficient value chain for edge-side AI.
In the future, SIMCOM will soon introduce more high-performance smart modules, working with global partners to accelerate the implementation of edge-side AI applications.
5G
As the upgraded version of 5G technology, 5G-Advanced (5G-A) also attracted significant attention at this year’s MWC. 5G-A not only improves network performance but more importantly, it begins to deeply integrate with various industries, driving digital transformation across sectors.
At the exhibition, several telecom operators showcased practical use cases of 5G-A technology in fields such as industrial IoT, low-altitude economy, and remote healthcare. Major telecommunications equipment manufacturers also demonstrated end-to-end solutions and industry application cases based on 5G-A technology, gradually bringing 5G-A technology to life.
SIMCOM has also strategically entered the 5G-A field early on. The SIMCOM SIM8390, an upgraded version of 5G, supports Sub-6GHz and mmWave frequency bands, offering higher speeds, lower latency, greater connection scale, and lower energy consumption. It has become favored by industry customers in high-speed applications and premium markets in Europe.
SIMCOM’s 5G-A strategy focuses not only on technological upgrades but also on industry adaptability. By collaborating with operators and equipment manufacturers, SIMCOM offers end-to-end solutions that help customers quickly integrate the full chain from network deployment to application, acting as an “accelerator” for enterprise digital transformation.
6G
At this year’s MWC, many companies showcased their latest research results and future plans regarding 6G technology.
Currently, 6G technology is expected to be fully commercialized around 2030, with transmission rates potentially reaching 1Tbps, far exceeding current 5G capabilities. Additionally, 6G will support AI-native networks, holographic communication, low Earth orbit satellite networks, and other advanced technologies, driving the arrival of the Internet of Everything era. In the consumer electronics sector, the introduction of 6G technology will empower smart terminal devices with higher performance and richer functionalities.
Although the commercialization of 6G is still some years away, SIMCOM has already laid the groundwork for its technological advancement. In 2023, the company launched the SIM7070G-HP-S, a satellite communication module supporting 3GPP NTN (Non-Terrestrial Networks). This module supports 3GPP Rel-17 (IoT-NTN) satellite communications in the L-band (B255) and S-band (B256/B23) frequency ranges. It also supports Cat-M/Cat-NB2 wireless communication modes and can be applied in maritime, transportation, agriculture, and energy sectors, contributing to the promotion and implementation of satellite IoT applications.
This year’s MWC 2025 highlighted three cutting-edge technologies: AI, 5G-A, and 6G, showcasing the latest trends and innovative achievements in the global telecommunications industry. As a pioneer in the global IoT communication module industry, SIMCOM actively participated and demonstrated its strong capabilities and forward-thinking vision in the field of communication technology. As these technologies continue to develop and be applied, we will usher in a more intelligent, digital, and interconnected future.
On March 5, during the 2025 World Mobile Congress (MWC Barcelona 2025), Fibocom unveiled the compact Cat.M module MQ780-GL, based on the Qualcomm® E51 4G modem and RF solution. The Fibocom MQ780-GL, with its four core advantages of ultra-compact size, ultra-low power consumption, global frequency band coverage, and stable network compatibility, provides cost-effective IoT connectivity solutions for scenarios such as smart metering, asset tracking, and smart cities, accelerating the commercialization of LPWA technology on a large scale.
Dual-Mode Support, Flexible Deployment
Fibocom MQ780-GL supports 3GPP Release 14 Cat.M1 and NB-IoT standards, allowing automatic mode switching based on the network environment to maximize coverage and connection reliability. The 4G LPWA module is compatible with global mainstream frequency bands, suitable for LPWA network deployments in North America, Europe, Asia, and other regions, facilitating stable global connections.
Compact Size, Ultra-Low Power Consumption
Fibocom MQ780-GL incorporates advanced power management technology, supporting PSM (Power Saving Mode) and eDRX (extended Discontinuous Reception) functions, significantly extending the battery life of devices. In PSM mode, the standby current is as low as microampere level (μA), making it suitable for devices such as water meters and gas meters that require more than 10 years of battery life. The Fibocom 4G module adopts an LCC+LGA package design, suitable for space-constrained IoT devices.
Enhanced Performance, Rich Interfaces
Fibocom MQ780-GL supports a variety of network protocols such as MQTT/CoAP/LwM2M, and is compatible with standard interfaces such as UART/I2C/I2S, facilitating expansion to more IoT devices. In terms of positioning capabilities, the MQ780-GL has built-in Soft GPS positioning function, meeting the high-precision positioning needs of scenarios such as asset tracking. Fibocom MQ780-GL also has a built-in hardware-level security engine, supporting data encryption and security authentication, ensuring the security of device and network communication.
Recently, Quectel’s 5G RedCap module RG255C-GL achieved another milestone by successfully passing the certification from two major North American operators. This certification marks that the module now fully meets the high standards of North American carriers, offering more efficient and reliable RedCap connectivity to local users, further strengthening Quectel’s competitive edge in the global IoT market.
Technological Innovation: Lightweight 5G Empowering Vertical Industries
The Quectel RG255C-GL module is based on the Qualcomm® Snapdragon® X35 platform and is equipped with 5G RedCap technology, specifically designed for high-speed IoT scenarios. As a lightweight 5G technology defined by the 3GPP R17 standard, RedCap reduces the number of terminal antennas, lowers modulation complexity, and decreases bandwidth requirements. While retaining key 5G benefits like low latency, high reliability, and network slicing, it significantly optimizes device cost, size, and power consumption, filling the market gap between traditional eMBB and LPWA.
This 5G Redcap module supports 5G Sub-6 Standalone (SA) mode and LTE Cat 4 networks, with peak download speeds of 223 Mbps and peak upload speeds of 123 Mbps, making it suitable for entry-level FWA applications, industrial sensors, and high-definition video transmission in mid- to high-speed IoT scenarios. It also supports key 5G features such as 5G LAN, uRLLC, and network slicing. In terms of positioning, the RG255C-GL integrates Qualcomm® IZat™ location technology, supporting global mainstream satellite positioning systems such as GPS, GLONASS, BDS, Galileo, and NavIC, providing precise location services for smart terminals.
High Integration Design: “Compact Size” Empowering “Large Scenarios”
The Quectel RG255C-GL adopts an LGA package with dimensions of 32.0 mm × 29.0 mm × 2.4 mm, making it compact in design. The Quectel 5G module’s size is consistent with and compatible with Quectel’s classic LTE Cat 4 module EG2x series, significantly reducing the hardware adjustment requirements for customers migrating from 4G to 5G, shortening development cycles, and lowering mass production costs. Additionally, the Quectel 5G module integrates a variety of interfaces, including USB 2.0, PCIe 2.0, PCM, UART, SGMII, and SPI, and can be paired with multiple Quectel antennas, helping terminal manufacturers quickly bring products to market and seize business opportunities.
Previously, the Quectel RG255C-GL had successfully obtained GCF global certification, North American FCC, IC, PTCRB certifications, European CE certification, and Australian RCM certification. With this latest certification from two major North American operators, the module will promote the large-scale deployment of 5G RedCap technology in global FWA and industrial automation scenarios. Moving forward, Quectel will continue to deepen its cooperation with global operators and industry partners, empowering the digital transformation of various industries with innovative technologies.
On March 5, during the 2025 Mobile World Congress (MWC Barcelona 2025), Fibocom and MediaTek jointly demonstrated the technical performance of the FG370 module based on the MediaTek T830 platform, featuring Modem AI and 3Tx (3-antenna transmission) + L4S (Low Latency, Low Loss, and Scalable Throughput). These features meet the product development needs of global leading operators for 5G FWA (Fixed Wireless Access) and MiFi (Mobile Broadband) in their respective application scenarios, including precise network prediction, intelligent network selection strategies, and optimized air interface performance.
Fibocom FG370, equipped with MMAI (MediaTek Modem AI), significantly enhances network connection efficiency in four weak-signal scenarios: high-speed railways, underground environments, airports, and remote suburban areas. In airports, AI-driven network prediction improves network search speed by over 50%. In outdoor mobile scenarios, MMAI provides an AI hiking mode, optimizing weak-signal and high-power consumption issues, resulting in a 10% energy saving for devices. In high-speed railway scenarios, Fibocom 5G AI module with MMAI ensures faster and more stable terminal connectivity, while in underground environments, it enables rapid 5G network recovery.
Most connected terminals support only two transmission chains, which greatly limits uplink throughput. Fibocom FG370, applied in 5G FWA and MiFi, utilizes 3Tx technology to support three transmission chains, significantly boosting peak uplink throughput. According to Fibocom’s lab tests, compared to 2Tx, 3Tx can increase throughput by up to 68% by adding spatial streams. The L4S technology provides terminals with a low-latency, low-packet-loss, and scalable throughput network experience. Tests show that combining 3Tx and L4S delivers 1.9 times the bandwidth of 2Tx while significantly reducing latency.
Additionally, The FG370 5G AI Module supports 8Rx and 3GPP Rel-17 standards, including HUPE TDD PC2/PC1.5 and FDD PC2 communication capabilities, greatly improving signal quality at the cell edge and enhancing throughput. Fibocom assists global leading operators in rapidly developing 5G FWA and MiFi products, reducing development costs while improving efficiency. Based on user needs, Fibocom will continue to develop and support key 5G technologies, enabling the widespread adoption of 5G FWA and MiFi in more scenarios.
From March 3-6, the highly anticipated “MWC 2025 World Mobile Communication Conference” was grandly held in Barcelona, Spain. As the premier event in the global mobile communication industry, MWC 2025 gathered the world’s top tech innovators and industry leaders. At this conference, SIMCom showcased its AI and GNSS modules, along with products and terminals spanning 5G, 4G, LPWA, and other fields. These can be applied in various scenarios such as smart payments, smart vehicles, smart industries, smart healthcare, and smart cities, demonstrating SIMCom’s deep expertise and latest achievements in the AIoT field.
Europe, the world’s second-largest IoT market, is undergoing a profound transformation from “scalable connectivity” to “intelligent and low-carbon solutions.” As a leader in the IoT communication sector, SIMCom chose Europe as one of its primary expansion destinations from the early stages, winning widespread recognition in the European market through years of accumulation and innovation.
SIMCom AI Stack: Full-Stack AI + Multi-Module Matrix Sparks Attention
On the first day of the exhibition, SIMCom’s Vice President Wang Benxi ignited the audience with a specialized AI presentation and unveiled SIMCom’s first full-stack AI solution.
SIMCom AI Stack is a full-stack AI solution carefully crafted by SIMCom for edge-side intelligent applications, offering computing power configurations ranging from 1 TOPS to over 40 TOPS. Built on the SIMCom AIoT module matrix, it integrates cutting-edge AI algorithms and efficient hardware design, covering a wide range of AI models and practical tools. This provides users with the core engine for the era of connected intelligence.
From smart home interactions to precision detection in smart industries, SIMCom AI Stack offers robust technical support for intelligent upgrades across various industries, injecting tremendous power. It quickly attracted the enthusiastic attention and discussions of the audience upon its debut.
5G, AI, GNSS Modules: Multi-Faceted Evolution
In addition, SIMCom’s Regional Sales Director for Europe, Mads Wendelin Fischer, delivered a keynote focusing on next-generation products. He shared SIMCom’s series of R&D achievements in 5G, AI, and GNSS fields, including the domestically developed 5G module A8230, the high-performance AI module SIM8965, and the cost-effective single-frequency 4-star GNSS modules SIM32EA and SIM65M-C. These modules have been optimized in terms of platform, performance, size, power consumption, and compatibility, providing richer and more flexible solutions to global customers.
In the 5G field, SIMCom’s A8230 module, based on the domestically developed ASR1903 platform, is a compact, lightweight, and cost-effective 5G RedCap module. It adopts 3GPP Rel-17 RedCap technology, backward compatible with 4G, supports 5G SA mode, multi-access edge computing, and other advanced features, making it ideal for applications in smart homes, wearable devices, industrial automation, and smart cities.
In the AI field, the SIM8965 module is a high-performance 4G Android intelligent module equipped with a Qualcomm 8-core 64-bit Kryo260 processor, with a frequency of up to 2.0GHz, an Adreno 610@950MHz GPU, and dual HVX512. It supports multiple HD cameras and capacitive touchscreens, delivering high-speed data transmission and multimedia AI processing capabilities.
In the GNSS field, SIMCOM SIM32EA supports four satellite systems: GPS, GLONASS, Galileo, and QZSS, with 47 GNSS receiving channels. It can simultaneously receive and process multiple satellite signals. Integrated with an antenna for easy design, its AIROHA high-sensitivity navigation engine ensures high sensitivity, accuracy, and fast first-fix time (TTFF) while maintaining low power consumption.
SIMCOM SIM65M-C module, with its compact size and support for five satellite systems (BEIDOU, GPS, GLONASS, GALILEO, QZSS), high cost-performance, and CE, ROHS, and REACH certifications, is an ideal choice for global GNSS customers.
Scene-Based Implementation: Edge AI Leading Digital Transformation
At the MWC 2025 venue, SIMCom’s booth was crowded with attendees, and the new generation of modules captured the attention of numerous professionals and media. The launch of SIMCom AI Stack sparked intense discussions.
During the exhibition, SIMCom also showcased its high-end modules such as the 5G RedCap series SIM8230, the 5G series SIM8270, SIM8260, as well as high, mid, and entry-level intelligent modules, catering to various needs for computing power and frequency bands. Meanwhile, the 4G module series A7683E, SIM7600, and LPWA module series Y7080E, SIM7070 were also presented. These modules can be widely applied in scenarios like smart factories, vehicle-road collaboration, low-carbon cities, and robotics, helping drive the digital and green energy transformation of industries in the European market and embedding edge AI across various industries.
Looking ahead, SIMCom will continue to focus on cutting-edge technological trends, launching smarter and more efficient products and solutions. Together with global partners, it will continue to push forward the development of the IoT communication industry, contributing more wisdom and strength to the prosperous development of the global IoT industry.